Semiconductor Metrology

InSight WLI with 300mm Wafer Handler

Automated, Gage-Capable Metrology for R&D and Production

Overview

The fully automated InSight WLI system offers unmatched optical surface measurement capabilities with wafer-handler integration. Designed from the ground up for the most demanding R&D, quality assurance, and process quality control needs, the InSight WLI incorporates Bruker's patented tip/tilt head, a proprietary self-calibrating laser reference, integrated pattern recognition, and a host of other Bruker-exclusive interferometry innovations. No other metrology system provides the non-contact accuracy, throughput, and operator convenience for such a vast range of production metrology and imaging applications.

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InSight WLI

Benchmark for Accuracy and Robustness

  • Unique metrology sensor design with patented dual-LED light source
  • Self-calibrating, metrology optimizing laser reference
  • Integrated vibration-isolation floor-mount cabinet
Production GUI
Bump array on full die coplanarity and defect
Bump array on full die - Coplanarity & Defect: Shape Accuracy
Robust metrology independent from color/reflectivity

Fastest, Easiest Nanometer-Scale Measurements

  • Fully automated measurement capabilities
  • Industry leading gage on nanometer-scaled features

Most Powerful Measurement and Analysis

  • Streamlined, customizable production interface
  • Flexible recipe and automation measurement optimization
  • Extensive library of filters and customizable analysis options

Configurations for Demanding Advanced Packaging

  • Complete die flatness and CMP metrology solution
  • TSV and interconnect measurements
  • Hot-spot and defect detection on full reticle die

Factory Automation Ready

  • SECS/GEM
  • S2/S8 Compliant
  • FDC, DCOL available
Copper Pillar Solder Bumps Height Width and Photo Resist Thickness
Copper Pillar / Solder Bumps Height - Width and Photo Resist Thickness: One head & Fast throughput with nanometer repeatability
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